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January 2008

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Subject:
From:
Herminia Guevarra <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Herminia Guevarra <[log in to unmask]>
Date:
Tue, 8 Jan 2008 12:49:24 -0500
Content-Type:
text/plain
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text/plain (98 lines)
I need it too...Thanks

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Tuesday, January 08, 2008 12:17 PM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] Warpage of components

Can this warpage calculation be shared with other like my self?

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Tuesday, January 08, 2008 9:56 AM
To: [log in to unmask]
Subject: [TN] SV: [TN] Warpage of components

I promised a simple warpage calculation formula, if not too many, I'll send
offline...
Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier /*
Skickat: den 8 januari 2008 14:15
Till: [log in to unmask]
Ämne: Re: [TN] Warpage of components

HI Ingemar,
Well said.
A warpage criterion for components would have to be based on a total 
out-of-plane measurement at soldering temperatures. This non-coplanarity
measure would 
have to be about the thickness of the solder paste layer to avoid solder 
opens, and it would have to be based on the total final solder joint
thickness to 
avoid solder joint cracking due to warpage tensile loads on cooling from 
reflow.

Werner



**************
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