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January 2008

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Tue, 8 Jan 2008 09:29:31 -0700
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I couldn't have said it any better, maybe with a little more whit, but
not any better technically. Just like cookies at X-mas, we all have our
melting moments.
Dewey 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Monday, January 07, 2008 9:56 AM
To: [log in to unmask]
Subject: Re: [TN] Reflow profile development - correct starting
temperature for evaluating TAL using non-eutectic solders

Hi Joe,
Unfortunately, a natural outcome of a proper reflow profile has become a

parameter to be aimed at. TAL is NOT a proper reflow parameter, and
assures in and 
of itself not good wetting and metallurgical bonding.
Adequate solder joint quality is assured with achieving Liquidus+20 C
for 5 
seconds at the slowest heating solder joint in the assembly. So whatever
the 
Liquidus temperature is for your solder alloy +20 for 5 seconds. For
eutectic 
SnPb that means 203C for 5 seconds at the slowest heating solder joint,
which of 
course means everything else on the assembly will see higher peak 
temperatures for longer times [except for vapor phase, of course]. 

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com



**************
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