HI Ingemar,
Well said.
A warpage criterion for components would have to be based on a total 
out-of-plane measurement at soldering temperatures. This non-coplanarity measure would 
have to be about the thickness of the solder paste layer to avoid solder 
opens, and it would have to be based on the total final solder joint thickness to 
avoid solder joint cracking due to warpage tensile loads on cooling from 
reflow.

Werner



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