Phillip

The technology I was eluding to was for a gold over nickel contact with the 
solder sites covered with an OSP.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message ----- 
From: "Phillip Bavaro" <[log in to unmask]>
To: "TechNet E-Mail Forum" <[log in to unmask]>; "Lee parker" <[log in to unmask]>
Cc: <[log in to unmask]>
Sent: Monday, January 07, 2008 4:03 PM
Subject: Re: [TN] OSP w selective gold


> Is it true that eliminating the nickel step affects the wetting 
> properties,
> and therefore selective gold is only used as a non-solderable conductive
> contact surface?
>
>
>
>
>
> At 07:06 PM 1/4/2008 -0500, Lee parker wrote:
> >Genny
> >
> >OSP/immersion gold (I assume you are alluding to immersion gold) boards 
> >have
> >been fabricated in Asia for several years for the cellular phone handset
> >industry. The big issue I am aware of is in fabrication of the board; it 
> >has
> >been necessary to use particular immersion gold processes, which your fab
> >has is probably aware of.
> >
> >Best regards
> >
> >Lee
> >
> >J. Lee Parker, Ph.D.
> >JLP Consultants LLC
> >804 779 3389
> >
> >
> >----- Original Message -----
> >From: "Genny Gibbard" <[log in to unmask]>
> >To: <[log in to unmask]>
> >Sent: Thursday, January 03, 2008 5:22 PM
> >Subject: [TN] OSP w selective gold
> >
> >
> >We have never used OSP for anything, but we may be required to switch
> >one of our products to it.  Can anyone point me in the direction of some
> >good solid info regarding working with this finish?
> >How common is it, especially if you need selective gold?  Are there any
> >solder process pitfalls to watch out for?
> >This is for leadfree products.
> >
> >Thanks in advance,
> >Genny.
> >
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