Genny,
Getting a little past my expertise. I can tell you it is not in Werner's
white paper, at least not in the version I have. This may also be
different dimensions for different chemistries and/or supplier
equipment. You should check with your supplier.
Bev
RIM
-----Original Message-----
From: Genny Gibbard [mailto:[log in to unmask]]
Sent: Monday, January 07, 2008 4:16 PM
To: TechNet E-Mail Forum; Bev Christian
Subject: RE: [TN] OSP w selective gold
Thank you. That is the reason why we need selective gold - for a
conductive contact surface.
Bev, where can I find info on the keep-out distance?
Or is this also in Werner's paper, so I can build my case a little
stronger for the company to buy this paper? :-)
Thanks.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: January 7, 2008 3:10 PM
To: [log in to unmask]
Subject: Re: [TN] OSP w selective gold
Phil,
If you do not put in the nickel layer in a traditional ENIG finish, what
is to keep the copper and gold from diffusing together and giving you a
surface that does not solder?
We use it for surfaces that are soldered.
Genny,
There are keep out distances between the OSP and the gold known to your
board manufacturer that you must be cognizant of.
Bev
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phillip Bavaro
Sent: Monday, January 07, 2008 4:03 PM
To: [log in to unmask]
Subject: Re: [TN] OSP w selective gold
Is it true that eliminating the nickel step affects the wetting
properties, and therefore selective gold is only used as a
non-solderable conductive
contact surface?
At 07:06 PM 1/4/2008 -0500, Lee parker wrote:
>Genny
>
>OSP/immersion gold (I assume you are alluding to immersion gold) boards
have
>been fabricated in Asia for several years for the cellular phone
handset
>industry. The big issue I am aware of is in fabrication of the board;
it has
>been necessary to use particular immersion gold processes, which your
fab
>has is probably aware of.
>
>Best regards
>
>Lee
>
>J. Lee Parker, Ph.D.
>JLP Consultants LLC
>804 779 3389
>
>
>----- Original Message -----
>From: "Genny Gibbard" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Thursday, January 03, 2008 5:22 PM
>Subject: [TN] OSP w selective gold
>
>
>We have never used OSP for anything, but we may be required to switch
>one of our products to it. Can anyone point me in the direction of
some
>good solid info regarding working with this finish?
>How common is it, especially if you need selective gold? Are there any
>solder process pitfalls to watch out for?
>This is for leadfree products.
>
>Thanks in advance,
>Genny.
>
>---------------------------------------------------
>Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
>unsubscribe, send a message to [log in to unmask] with following text
in
>the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt
>or (re-start) delivery of Technet send e-mail to
>[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
>per day of all the posts: send e-mail to
>[log in to unmask]: SET Technet Digest
>Search the archives of previous posts at:
http://listserv.ipc.org/archives
>Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
>for additional information, or contact Keach Sasamori at [log in to unmask]
or
>847-615-7100 ext.2815
>-----------------------------------------------------
>
>---------------------------------------------------
>Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
>unsubscribe, send a message to [log in to unmask] with following text
in
>the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt
>or (re-start) delivery of Technet send e-mail to
>[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
>per day of all the posts: send e-mail to
>[log in to unmask]: SET Technet Digest
>Search the archives of previous posts at:
http://listserv.ipc.org/archives
>Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
>for additional information, or contact Keach Sasamori at [log in to unmask]
or
>847-615-7100 ext.2815
>-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential
information, privileged material (including material protected by the
solicitor-client or other applicable privileges), or constitute
non-public information. Any use of this information by anyone other than
the intended recipient is prohibited. If you have received this
transmission in error, please immediately reply to the sender and delete
this information from your system. Use, dissemination, distribution, or
reproduction of this transmission by unintended recipients is not
authorized and may be unlawful.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
