Gold reacts with copper, thus the nickel barrier. I have many examples
of nickel skips, the copper migrates up through the gold and you get a
bright orange colored pad that you cannot solder to.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phillip Bavaro
Sent: Monday, January 07, 2008 3:03 PM
To: [log in to unmask]
Subject: Re: [TN] OSP w selective gold
Is it true that eliminating the nickel step affects the wetting
properties, and therefore selective gold is only used as a
non-solderable conductive contact surface?
At 07:06 PM 1/4/2008 -0500, Lee parker wrote:
>Genny
>
>OSP/immersion gold (I assume you are alluding to immersion gold) boards
>have been fabricated in Asia for several years for the cellular phone
>handset industry. The big issue I am aware of is in fabrication of the
>board; it has been necessary to use particular immersion gold
>processes, which your fab has is probably aware of.
>
>Best regards
>
>Lee
>
>J. Lee Parker, Ph.D.
>JLP Consultants LLC
>804 779 3389
>
>
>----- Original Message -----
>From: "Genny Gibbard" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Thursday, January 03, 2008 5:22 PM
>Subject: [TN] OSP w selective gold
>
>
>We have never used OSP for anything, but we may be required to switch
>one of our products to it. Can anyone point me in the direction of
>some good solid info regarding working with this finish?
>How common is it, especially if you need selective gold? Are there any
>solder process pitfalls to watch out for?
>This is for leadfree products.
>
>Thanks in advance,
>Genny.
>
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