Phil,
If you do not put in the nickel layer in a traditional ENIG finish, what
is to keep the copper and gold from diffusing together and giving you a
surface that does not solder?
We use it for surfaces that are soldered.
Genny,
There are keep out distances between the OSP and the gold known to your
board manufacturer that you must be cognizant of.
Bev
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phillip Bavaro
Sent: Monday, January 07, 2008 4:03 PM
To: [log in to unmask]
Subject: Re: [TN] OSP w selective gold
Is it true that eliminating the nickel step affects the wetting
properties,
and therefore selective gold is only used as a non-solderable conductive
contact surface?
At 07:06 PM 1/4/2008 -0500, Lee parker wrote:
>Genny
>
>OSP/immersion gold (I assume you are alluding to immersion gold) boards
have
>been fabricated in Asia for several years for the cellular phone
handset
>industry. The big issue I am aware of is in fabrication of the board;
it has
>been necessary to use particular immersion gold processes, which your
fab
>has is probably aware of.
>
>Best regards
>
>Lee
>
>J. Lee Parker, Ph.D.
>JLP Consultants LLC
>804 779 3389
>
>
>----- Original Message -----
>From: "Genny Gibbard" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Thursday, January 03, 2008 5:22 PM
>Subject: [TN] OSP w selective gold
>
>
>We have never used OSP for anything, but we may be required to switch
>one of our products to it. Can anyone point me in the direction of
some
>good solid info regarding working with this finish?
>How common is it, especially if you need selective gold? Are there any
>solder process pitfalls to watch out for?
>This is for leadfree products.
>
>Thanks in advance,
>Genny.
>
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