Is it true that eliminating the nickel step affects the wetting properties, 
and therefore selective gold is only used as a non-solderable conductive 
contact surface?





At 07:06 PM 1/4/2008 -0500, Lee parker wrote:
>Genny
>
>OSP/immersion gold (I assume you are alluding to immersion gold) boards have
>been fabricated in Asia for several years for the cellular phone handset
>industry. The big issue I am aware of is in fabrication of the board; it has
>been necessary to use particular immersion gold processes, which your fab
>has is probably aware of.
>
>Best regards
>
>Lee
>
>J. Lee Parker, Ph.D.
>JLP Consultants LLC
>804 779 3389
>
>
>----- Original Message -----
>From: "Genny Gibbard" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Thursday, January 03, 2008 5:22 PM
>Subject: [TN] OSP w selective gold
>
>
>We have never used OSP for anything, but we may be required to switch
>one of our products to it.  Can anyone point me in the direction of some
>good solid info regarding working with this finish?
>How common is it, especially if you need selective gold?  Are there any
>solder process pitfalls to watch out for?
>This is for leadfree products.
>
>Thanks in advance,
>Genny.
>
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