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January 2008

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Subject:
From:
Guy Ramsey <[log in to unmask]>
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Date:
Mon, 7 Jan 2008 15:28:27 -0500
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Got a BGA warping on you? 

We saw this problem on an Altera Flex484. A contact at Lucent put me in
touch with a package designer at Altera. With his advice we were able to
develop a reflow profile and rework procedure that worked with the !@?%%
thing. 

We could not find a JEDEC spec with which to beat the supplier. 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Monday, January 07, 2008 9:30 AM
To: [log in to unmask]
Subject: [TN] Warpage of components

Technetters,

Are there any IPC or JEDEC specs that talk about component warpage AT REFLOW
TEMPERTURES?

Bev

RIM


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