Hi Clayton,
We are testing a small steam cleaner to be used for spot cleaning of a hand installed part or repaired part. This assumes an OA flux was used. For RMA fluxes, washing with a solvent (alcohol or a flux remover) Terry Munson best described it as just spreading the residue around unless you do a good job of rinsing.
I'm not sure what the point of no-clean is if in the end you need to clean it.
Just my 2¢.
Phil Nutting
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wrobel, Clayton
Sent: Friday, January 04, 2008 9:48 AM
To: [log in to unmask]
Subject: Re: [TN] specifying board cleanliness
This topic has always left me scratching my head. We are a COTS
military supplier (NOT Milspec) with relatively low volumes, 500-1500
units per week. There is a fair amount of rework/repair.
Given:
Cleaning No-Clean assemblies can introduce problems
Hand soldering No-Clean materials does not, generally, fully
activate the chemistry an must be cleaned
Rework using RMA materials requires cleaning.
HOW do you clean the boards properly after rework? That is, what kind
of process can yield good long-term (7 year) results without testing?
Any ideas?
-----Original Message-----
From: Phil Nutting [mailto:[log in to unmask]]
Sent: Thursday, January 03, 2008 9:45 AM
Subject: specifying board cleanliness
Good Morning and Happy New Year to All,
Let me start by confessing my ignorance relative to cleanliness of
circuit boards. We have no idea what numbers to specify that fit into
the IPC testing methods for board cleanliness. If I tell my CMs to make
the boards clean, it would be good to specify a target value and or test
method.
Can someone give me some guidance on how to chose these specifications?
What are worth while tests and which ones are window dressing?
I've read through some of the IPC tests methods and my head hurts.
Thanks in advance,
Phil Nutting
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