Hi Gaby,
I take it what you are seeing are 'champagne voids.'
Voids like these are 'encouraged by rough topography copper, excessive Ag
thickness, some solder paste choices and rapid cool-down after reflow. But as
Donald Cullen says in his comprehensive paper, it "requires the “Perfect Storm”
of a rather contrived combination of parameters" to produce planar
micro-voiding.
Well Gaby, now you know it—you are "Perfect." ;-)
Werner
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