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Date: | Tue, 29 Jan 2008 10:24:20 -0800 |
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Actually it came up originally in the fall of 2003 as an issue with builds
made by a large internet equipment manufacturer in the bay area that is
based near San FranXXXXX.....work it out for yourself.
It was first published as a defect along with causes etc by McDermid in a
paper at Apex 2005 I believe.
Kind regards
John Burke
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of George Milad
Sent: Tuesday, January 29, 2008 8:53 AM
To: [log in to unmask]
Subject: Re: [TN] Microvoids immersion silver
The issue of microvoids at the solder interface when using immersion silver
as teh final finish was raised approximately a year ago by a major OEM.
Since then all major IAg suppliers have done their homework and corrected
the situation.
You are right most of the corrective action centered around the surface
topography before the IAg step, excessive silver thickness and the acidity
of the
silver bath.
The occurrence of excessive micro-voids aligned at the Solder/Copper
interface, also referred to as "Champagne" voids have been reduced
dramatically to
the point of elimination.
As in any chemical process, the manufacturer must follow vendor
specifications and keep the process under control to get the desired
outcome.
Regards
George Milad
George Milad
National Accounts Manager for Technology
Uyemura International Corp (UIC)
249 Town Line Rd
Southington CT 06489
[log in to unmask]
Cell: (516) 901 3874
**************Start the year off right. Easy ways to stay in shape.
http://body.aol.com/fitness/winter-exercise?NCID=aolcmp00300000002489
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