The issue of microvoids at the solder interface when using immersion silver  
as teh final finish was raised approximately a year ago by a major OEM.
Since then all major IAg suppliers have done their homework and corrected  
the situation. 
You are right most of the corrective action centered around the surface  
topography before the IAg step, excessive silver thickness and the acidity of  the 
silver bath.
The occurrence of excessive micro-voids aligned at the Solder/Copper  
interface, also referred to as "Champagne" voids have been reduced dramatically  to 
the point of elimination.
As in any chemical process, the manufacturer must follow vendor  
specifications and keep the process under control to get the desired outcome.  

Regards
George Milad
George Milad
National Accounts  Manager for Technology
Uyemura International Corp (UIC)
249 Town Line Rd  
Southington CT 06489
[log in to unmask]
Cell: (516) 901  3874




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