IPC Webcast Series:
Instructor: Michael Carano, OMG Electronic Chemicals
March 20, 2008 - 10:00 am - 11:00 am (CT)
Via Hole Filling Technology and Processes: An Overview
March 27, 2008 - 10:00 am - 11:00 am (CT)
Via Hole Filling Technology and Processes: The Rest of the Story
Circuit board fabricators need to adopt techniques such as via filling
capability for both blind and buried vias. The problem, of course, is
that with many new technologies, fabricators and end-users are faced
with a myriad of process technologies that they must choose from. This
IPC webcast series describes the technological drivers behind the need
for via filling in a highly effective and reliable fashion for high
density, high aspect ratio printed wiring boards. Close attention is
paid to the use of these via filling materials for highly complex
circuit designs.
Register by February 20, 2008 and save an additional 10% off the current
registration prices.
For more information, or to register, please cut and paste
www.ipc.org/ViaHole0308 into your browser and download the registration
form. Any additional questions, please contact Michelle Michelotti at
+1 847-597-2822 or e-mail at [log in to unmask]
PD-01: Fundamentals of Classic, HDI, Hybrid, Flex/Rigid Flex Multilayer
Printed Circuit Board Technology
March 4-5, 2008 - Bannockburn, Ill.
Instructors: Richard Snogren, Bristlecone LLC
Jason Ferguson, NAVSEA Crane
Will your job benefit if you have a clearer and more solid understanding
of PCB technology? Are you ready to advance your career by expanding
your capabilities and background? This workshop will help you build a
broad and in-depth PCB technology foundation by providing focused
curricula and learning experiences through lecture, hands-on samples,
and a virtual tour of a state-of-the-art PCB manufacturing facility.
PD-02: Hands-on PCB Manufacturing 101-Conventional Innerlayer Processing
April 22-24, 2008 - Crane, Ind.
Instructors: Richard Snogren, Bristlecone LLC
Jason Ferguson, NAVSEA Crane
Will your value to the company increase if you have a clearer and more
solid understanding of PCB technology? Are you ready to advance your
career by expanding your capabilities and background? Are you a new
process engineer starting a career in printed circuit technology? Have
you recently moved into a PCB manufacturing process engineering
position?
PD-03: Hands-on PCB Manufacturing 102-Conventional Outerlayer Processing
May 28-30, 2008 - Crane, Ind.
Instructors: Richard Snogren, Bristlecone LLC
Jason Ferguson, NAVSEA Crane
This Outerlayer Processing course is a detailed hands-on PCB fabrication
tutorial on classic or conventional multilayer boards. The multilayer
boards are built on the foundation of the March course, PCB Training,
Fundamentals of Classic, HDI and Hybrid Multilayer Printed Circuit Board
Technology. This workshop takes the innerlayers of that workshop and
runs them through the balance of the fabrication processes. Both the
March and april courses will show you how to characterize the
manufacturing processes in terms of capability, and thresholds of
through-put, and yields and how to present this information to designers
to help them understand cost vs. design characteristics.
For more information, or to register, please cut and paste
http://www.ipc.org/PCBTraining0308 into your browser and download the
registration form. Any additional questions, please contact Michelle
Michelotti at +1 847-597-2822 or e-mail at [log in to unmask]
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