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January 2008

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Mon, 28 Jan 2008 13:15:57 -0500
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Gaby

I installed the first immersion silver process in North America and 
qualified it at the AT&T assembly locations. I would suggest you do all of 
the above. Concerning Micro voids, read McDermid's (Don Cullen's) paper on 
this issue. It presents a great deal of imperial evidence on micro vias. You 
should also consider the fab supplier in this equation. A poorly implemented 
out of control process can render a poor product even though the chemistry 
may be sound and with a great pedigree.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389

----- Original Message ----- 
From: "Gabriela Bogdan" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, January 28, 2008 12:30 PM
Subject: [TN] Microvoids immersion silver


> Dear Netters,
> Is there a preferred process for immersion silver finish in order to 
> minimize microvoids?
> How do you choose the preferred immersion silver PCB supplier?
> Which test for bare boards could give the best information?
> Should I perform a print and reflow test for each batch, followed by 
> x-ray?
> Which tests are the suppliers performing?
> Thanks,
> Gaby
>
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