Gaby:  Perhaps the ideal process to minimize/eliminate microvoids is one that is almost unknown.   One of the more common issues in this process can be marginal developing of soldermask, which leaves residues on pads.  Other than the obvious move, of keeping the developer in good condition (not necessarily so easy, soldermask developers are very difficult to clean out properly), the other insurance operation that can be done is to put an alkaline cleaner before the microetch which precedes the silver bath.

This last suggestion should generate howls of protest, as everyone thinks that alkaliine cleaners strip soldermask... to which I can reply, not ALL of them do that.  There are alkaline cleaners specifically designed to clean Copper, and leave soldermask unaffected.

Good luck,
Rudy Sedlak
RD Chemical Company

Gabriela Bogdan <[log in to unmask]> wrote: Dear Netters,
Is there a preferred process for immersion silver finish in order to minimize microvoids?
How do you choose the preferred immersion silver PCB supplier?
Which test for bare boards could give the best information?
Should I perform a print and reflow test for each batch, followed by x-ray?
Which tests are the suppliers performing?
Thanks,
Gaby

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