TECHNET Archives

January 2008

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Gabriela Bogdan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gabriela Bogdan <[log in to unmask]>
Date:
Mon, 28 Jan 2008 19:30:16 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (19 lines)
Dear Netters,
Is there a preferred process for immersion silver finish in order to minimize microvoids?
How do you choose the preferred immersion silver PCB supplier?
Which test for bare boards could give the best information?
Should I perform a print and reflow test for each batch, followed by x-ray?
Which tests are the suppliers performing?
Thanks,
Gaby

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2