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January 2008

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Subject:
From:
Eric Bonatti <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Eric Bonatti <[log in to unmask]>
Date:
Mon, 28 Jan 2008 11:23:04 -0500
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Hello tech-netters,
I have a question about design of flex circuit connections and circuit
reliability:

We currently specify IPC-6013 class 2 final finish which gives us gold
plating of 0.8uM (or about 30microinches) thick.  On the contact side
however, the plating thickness is 0.15uM (or about 6microinches).
Similar zero insertion force sockets from other vendors have similar
plating thickness.  This leads me to believe that since most if not all
of the available ZIF sockets have this thin flash plating it must be
acceptable for most commercial applications.  Does this mean that the
class 2 finish we specify is not necessary?  Could we specify IPC-6013
class 1 final finish (4um or 15micro inch) and not give up reliability?

Any information you could give me on this topic will be appreciated.

Regards,

Eric Bonatti, C.I.D.+
EDA Group Leader
Phone: +1 905 812 6200 xt.3412
Fax: +1 905 812 6301
E-mail: [log in to unmask]
 
Psion Teklogix Inc.
2100 Meadowvale Boulevard, 
Mississauga, ON, L5N 7J9, Canada

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