Al, Paul, here is the right place to seek:

http://www.mrs.org/s_mrs/doc.asp?CID=7201&DID=180176

lot's of yum-yum


Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Paul Reid
Skickat: den 24 januari 2008 15:44
Till: [log in to unmask]
Ämne: Re: [TN] Coffin-Manson

Hi Al,

We have recently become interested in FEM. Our interest is in FEM as it
relates to printed wire boards. Specifically we are interested the
stress in PTHs during lead free assembly and rework and how that relates
to reliability and survivability in PWBs.

I have nothing to offer your on packaging question but would like to
establish some FEM contacts. We may be investigating FEM in relation to
PWB reliability in the future.

Sincerely,

Paul Reid

Program Coordinator

PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario
Canada, K2H 9C1

613 596 4244 ext. 229
Skype paul_reid_pwb
[log in to unmask] <mailto:[log in to unmask]>
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of al shirazi
Sent: Wednesday, January 23, 2008 1:24 PM
To: [log in to unmask]
Subject: Re: [TN] Coffin-Manson

Hello All,

I am interested to know if any body is currently involved with the FEM
modeling of the lead-less package with considering the effect of IMC in
their models under the thermal loading.Please advise me if you do so!

Thanks,
Al



       
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