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January 2008

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From:
al shirazi <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, al shirazi <[log in to unmask]>
Date:
Thu, 24 Jan 2008 07:48:05 -0800
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Hi Werner,

Sorry that was the subject of the other e-mail that I just used its block to send my e-mail.I guess I missed it!Sorry for the confusion!

In fact I am investigating the finite element models to include the intermetallic layer, to me should have a significant impact on thermo-mechanical durability of the SAC joint. The change of the solder composition near the intermetallic layer due to metalization. 
Please correct if I am wrong!

Al

Werner Engelmaier /* <[log in to unmask]> wrote: Hi Al, 
Why do you subject this "Coffin-Manson"?
Coffin-Manson does not work for solder.



Werner



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