Gosh! That was an ambigous task! We have done a number of FEM analysis jobs,
as you call it. The program we use is ANSYS/NASTRAN. From my point of view,
modeling with an IMC layer as one mesh layer will give you headache, because
an IMC layer is nearly impossible to characterize. An IMC layer has big
variations in thickness, the crystallographic situation varies endlessly,
the microhardness varies, the E-modulus is not to find in any books,  the
interface with the ambient metals/finishes varies, there may be Kirkendall
void etc. It's like trying to catch an eel with bare hands.
IF someone guru, like Werner Angelmajor, knows how to do, then I'll really
switch on my hearing aid and listen. 
Good Luck, hope someone can assist you!

Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För al shirazi
Skickat: den 23 januari 2008 19:24
Till: [log in to unmask]
Ämne: Re: [TN] Coffin-Manson

Hello All,

I am interested to know if any body is currently involved with the FEM
modeling of the lead-less package with considering the effect of IMC in
their models under the thermal loading.Please advise me if you do so!

Thanks,
Al



       
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