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January 2008

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Subject:
From:
Sue Powers-hartman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Sue Powers-hartman <[log in to unmask]>
Date:
Wed, 23 Jan 2008 09:58:17 -0600
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We are having a problem with tiny solder fines that are clinging to fine pitch 
SOIC leads, not on the solder mask, that are not being washed off in the 
cleaning process. Are solder fines considered the same as a solder ball, which 
means they all have to be removed, or is it acceptable to leave them alone.

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