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January 2008

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Subject:
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Sun, 20 Jan 2008 09:14:58 +0200
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Hi Werner,
 
Its depending (where are the HOPs) if the warpage is concave or convex.

Best Regards
Reuven ROKAH 
e mail: [log in to unmask]
 

________________________________

From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Friday, January 18, 2008 11:00 PM
To: Reuven Rokah; [log in to unmask]; [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Solderability of Tin-Gold
Intermetallic


Hi Reuven,
When you get HOPs at the BGA corners, warpage is a good guess at the
root cause, if they are in the center than infifficient peak reflow
temperature.



Werner



**************
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