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TechNet E-Mail Forum <[log in to unmask]>, Hfjord <[log in to unmask]>
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Sat, 19 Jan 2008 00:18:04 +0100
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So, this is the conclusion: Bev woke up with head in someone's pillow, when
he startled in confusion, the balls were pried off. He consulted TN docs for
a diagnosis, however, they did not see the whole picture, but did as docs
use to do: only looked at the bad organ instead of whole symptom. Bev
insisted there is nothing wrong with the balls, instead one should
investigate the pillow. Docs consulted each other, and, cautiously, proposed
the problem may be in Bev's head. Others suspected something was left on the
pillow, but what. If there was gold, which seemed unlike, it could come from
the balls, but many docs claimed that heavy metals like gold is normally not
accumulated in the balls. So, again, the docs had a discussion about the
pillow. Could the gold come from the pillow?  Golden pillows are generally
only seen with elderly women (they can be very well done).The discussions
went on, but ended in total disorientation. Finally, the docs did not see if
Bev had head or balls on the pillow. The ordination became very odd: Bev,
next time heat is on, don't bother about the wetting, let your fantasy play
with 'golden balls' it's OK, all will work if you just have the process in
an atmosphere that suits both parties, and stop having the head in a cushion
at the same time.

Still Friday..and Bev will kill me..

Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier /*
Skickat: den 18 januari 2008 21:43
Till: [log in to unmask]
Ämne: Re: [TN] SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic

Hi Bev & All,
I do not know why nobody responded to my e-mail. I said:
"Just like George, I am struggling getting an understanding of you problem.
To me, 'head-on-pillow' solder defects are almost always caused by 
insufficient peak temperature.
If these HOP's occurred essentially near the center of the BGA, you have
your 
answer,
If the HOP's are distributed over the whole array, than the root cause is
not 
insufficient peak temperature unless the whole reflow process is too low."

I am still betting on insufficient peak temperature. HOP implies a large 
pasty range; thus your solder(s) are not near eutectic. Whatever alloy they 
actually are, the insufficient peak temperature was too low to get them
fully liquid 
to join up.

Werner



**************
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