You also get HOP at BGA ball sites that have balls with a slightly

smaller diameter than the other balls and these can be anywhere in the

BGA array.



Regards,

George

George M. Wenger

CommScope / Andrew Wireless Solutions

Senior Principal FMA / Reliability Engineer

40 Technology Drive, Warren, NJ 07059

(908) 546-4531 [Office]  (732) 309-8964 [Cell]



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*

Sent: Friday, January 18, 2008 4:00 PM

To: [log in to unmask]

Subject: Re: [TN] SV: [TN] SV: [TN] Solderability of Tin-Gold

Intermetallic



Hi Reuven,

When you get HOPs at the BGA corners, warpage is a good guess at the

root 

cause, if they are in the center than infifficient peak reflow

temperature.







Werner







**************

Start the year off right.  Easy ways to stay in shape.

     

http://body.aol.com/fitness/winter-exercise?NCID=aolcmp00300000002489



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