Just out of curiosity given your comment; what happens to the MP of the
alloy with 4% Au? (I think the thread said 4% Au?)
If it increases the MP then your explanation becomes even more possible.



Rex Waygood
Technical Manager
 
PartnerTech Poole Ltd 
Benson Road
Poole
Dorset BH17 0RY
United Kingdom
 
Tel: +44 (0)1202 674333
Fax: +44 (0)1202 678028
DDI: +44 (0)1202 338222
Mob: +44 (0)7887 997403
 
[log in to unmask]
www.PartnerTech.co.uk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: 18 January 2008 12:58
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Solderability of Tin-Gold
Intermetallic

Hi Bev,
Just like George, I am struggling getting an understanding of you
problem.
To me, 'head-on-pillow' solder defects are almost always caused by
insufficient peak temperature.
If these HOP's occurred essentially near the center of the BGA, you have
your answer, If the HOP's are distributed over the whole array, than the
root cause is not insufficient peak temperature unless the whole reflow
process is too low.



Werner



**************
Start the year off right.  Easy ways to stay in shape.
     
http://body.aol.com/fitness/winter-exercise?NCID=aolcmp00300000002489

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

-------------------------------------------------------------------------------

The information contained within this e-mail and any attachments contained therein may be confidential and/or legally privileged and is for the use of the intended recipient only. If you are not the intended recipient please delete it from your system and notify the sender by return e-mail. The content of this e-mail may not be copied or disclosed to any third parties without prior permission from the sender. 

 

E-mail is susceptible to data corruption, interception, tampering and viruses. We do not accept any liability for any such incidents or any consequences thereof.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------