Dave and Werner,



Are both of you saying that the interaction between Sn (solder) and Cu(Ni)/Sn intermetallics is similar to interaction between Sn and Au/Sn ones?



As far as I know, Cu (or Ni) containing ones don't have as weak interface with Sn as the Au-containing one.



Regards,



Vladimir



----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Thu Jan 17 14:45:09 2008

Subject: Re: [TN] SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic



Thanks Dave,

Who said that an 'old dog' can't learn any new tricks? How did they keep the 

Cu3Sn and Cu6Sn5from oxidyzing? N2 enclosure?







Werner







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