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January 2008

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From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 17 Jan 2008 13:59:45 -0600
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Hi Werner! For the SERA work, we used the ROSA technology and a N2 
chamber. For the Wetting balance, NIST used immediate etch/test plus some 
conditioning. Also, Fidos and Schreiner did some work in 1970 using a 
vacuum chamber. Not a wealth of data but some reasonable information to 
use for understanding processes.

Dave



Werner Engelmaier /* <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
01/17/2008 01:45 PM
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Re: [TN] SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic






Thanks Dave,
Who said that an 'old dog' can't learn any new tricks? How did they keep 
the 
Cu3Sn and Cu6Sn5from oxidyzing? N2 enclosure?



Werner



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