Hi all,

We have some applications where we have used Sn05Pb95 alloy solder that has a melting temperature of 301° - 314° C.  Standard solders tend to melt when these devices go into a conduction mode and have a naturally high heat load that will of course "flow" down the component leads into the solder joint.

Now that things are being converted to lead-free the question is being raised about this solder.  So that prompts several questions.

1. I remember seeing somewhere in the RoHS specs a statement that >85% lead in a specific solder joint was an allowable exception.  Is this true?  I can't put my hand on the chapter and verse.

2. Is there a lead free alloy that is being used in industry that comes close to the melting temp of  the Sn05Pb95 alloy?

3. Can some of this be solved by the pad shape and creating something that acts like a heat sink in the copper to dissipate the heat?

4.  Has anybody else solved this problem?

Thanks in advance.

Phil Nutting

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