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January 2008

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Thu, 17 Jan 2008 10:42:21 -0500
Content-Type:
text/plain
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text/plain (74 lines)
Bingo!  There is the crux of it. I am not talking about joints already
made, I am talking about TRYING to MAKE joints.

I hope I don't get in trouble for this.

My original, vague question was because of - head in pillow. Inge
guessed correctly.

I don't mean to be rude, but we already have a very extensive fishbone
for this, so please don't come back with the usual reasons.  They are
being addressed, trust me.

What I am exploring is whether unusual amounts of gold tin
intermetallics on the surface of the solder balls pried off of boards
that show head in pillow did not solder because of these materials.  

Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Thursday, January 17, 2008 10:36 AM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Solderability of Tin-Gold
Intermetallic

Hi All,
We know that Cu6Sn5 is non-solderable after oxidation. However, I do not
know 
whether we really KNOW that it is solderable prior to that, and we know
even 
less about the solderability of AuSn4, Ag3Sn, or for that matter Sn3Ni4.



Werner



**************
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