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January 2008

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Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Thu, 17 Jan 2008 09:48:56 +0100
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So, a gold/copper alloy wedding ring will fall apart if your finger is wet...hmmmm...but it will take some time, wuntit?
/Inge 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: den 17 januari 2008 09:23
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic


Can I add a wee bittie more hypothesis to the arguments? The electrochemical potentials of gold and tin differ by 1.8295 V, which is boooody enormous. In the presence of humidity, it is conceivable that important corrosion currents could flow between gold-rich and tin-rich areas on the surface...

???

Brian

Werner Engelmaier /* wrote:
> Hi Inge,
> I visited Gerd Becker twice in Swedenâ  besides being a great guy, he was of 
> course Eicsson's soldering guru.
> 
> Werner
> 
> 
> 
> **************
> Start the year off right.  Easy ways to stay in shape.
>      
> http://body.aol.com/fitness/winter-exercise?NCID=aolcmp00300000002489
> 
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