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January 2008

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 16 Jan 2008 16:58:09 EST
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text/plain
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Hi Bev,
The AuSn platelets do not stop the wetting to the rest of the surface.

The AuSn platelets are not likely to disolve in a soldering process.

If there is too muc mof a concentration, they are likely to cause 
Au-embrittlement problems.



Werner



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