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January 2008

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Subject:
From:
Tina Nerad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tina Nerad <[log in to unmask]>
Date:
Wed, 16 Jan 2008 13:38:09 -0600
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IPC/JEDEC International Conference on Reliability, Rework and Repair

of Lead-Free Electronics

Technical Conference - March 11, 2008

Educational Courses - March 12, 2008

Raleigh, N.C.

With lead-free soldering processes approved and implemented, increased
emphasis is placed on rework and repair as a significant challenge.
Considered a weak link in the lead-free process control chain, lead-free
soldering requires rigorous control of the thermal process given the
higher processing temperatures and reduced process window. The paradox
between higher process temperatures of lead-free alloys and the thermal
threshold of electronic components during the rework and repair process
forms the basis of the lead-free challenge. How reliable is your rework?

IPC and JEDEC are pleased to present the International Conference on
Reliability, Rework, and Repair of Lead-Free Electronics, March 11-12,
2008, in Raleigh, North Carolina. This conference will address the
issues faced as a result of implementing a lead-free process such as
alloy choices, component compatibility and solder concerns.

For more information or to register, please cut and paste
www.ipc.org/RRR0308 into your browswer or contact Alexandra Curtis +1
847-597-2877 or e-mail [log in to unmask]

 

 


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