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January 2008

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Subject:
From:
"Igoshev, Vladimir" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Igoshev, Vladimir
Date:
Wed, 16 Jan 2008 09:25:06 -0500
Content-Type:
text/plain
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text/plain (65 lines)
Bev,

Based on what I've seen just recently it shouldn't. We can talk off
line, if you need more details.

Regards,

Vladimir


AMD

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Wednesday, January 16, 2008 8:52 AM
To: [log in to unmask]
Subject: [TN] Solderability of Tin-Gold Intermetallic

Technetters,
We all know that the tin-copper intermetallic has terrible
solderability.  I also know there are high melting tin-gold solders.  My
question is: what is the solderability of surfaces of tin with small
amounts of gold (<4%) in it? As good as 100% tin, better, worse?  If
worse, how much so?
Bev
RIM

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