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January 2008

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Wed, 16 Jan 2008 09:20:00 -0500
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I'm not sure I can give you a direct answer for tin but I c
Bev,



I'm not sure I can give you a direct answer for tin but I can give you

an answer for SnPb solder.  In the RF world there are lots of gold

plated components that can have very thick gold (>2.5um).  Because of

solder joint reliability reliability concerns it has been standard

practice to pre-tin (expose to SnPb wave or use a double dip in to

solder pots) to dissolve most of the gold) and the resulting pre-tinned

surface does contain some gold.  The amount of gold remaining in the

solder on the surface of the components is dependent on the quality of

the pr-tinning process.  However, we've seen many surfaces of pre-tinned

components with up to at least 4% gold and have not seen any

solderability issues.





Regards, 

George 

George M. Wenger 

Senior Principle FMA / Reliability Engineer 

CommScope / Andrew Wireless Solutions 

40 Technology Drive, Warren, NJ 07059 (908) 546-4531

[log in to unmask] 





-----Original Message-----

From: Bev Christian [mailto:[log in to unmask]] 

Sent: Wednesday, January 16, 2008 9:04 AM

To: Wenger, George M.; TechNet E-Mail Forum

Subject: RE: [TN] Solderability of Tin-Gold Intermetallic



George,

Correct of course.  That is what I meant.  How about my question?

Bev

RIM



-----Original Message-----

From: Wenger, George M. [mailto:[log in to unmask]]

Sent: Wednesday, January 16, 2008 9:03 AM

To: TechNet E-Mail Forum; Bev Christian

Subject: RE: [TN] Solderability of Tin-Gold Intermetallic



Bev,

I think I would re-state your first sentence.  "We all know that

tin-copper intermetallic that has come to the surface and been exposed

to the environment has terrible solderability."  I view tin-copper as

the glue layer between solder and copper when solder touches copper and

forms an intermetallic the solder above the intermetallic must wet it

otherwise it would fall off. 





Regards,

George

George M. Wenger

Senior Principle FMA / Reliability Engineer CommScope / Andrew Wireless

Solutions 40 Technology Drive, Warren, NJ 07059 (908) 546-4531

[log in to unmask] 





-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian

Sent: Wednesday, January 16, 2008 8:52 AM

To: [log in to unmask]

Subject: [TN] Solderability of Tin-Gold Intermetallic



Technetters,

We all know that the tin-copper intermetallic has terrible

solderability.  I also know there are high melting tin-gold solders.  My

question is: what is the solderability of surfaces of tin with small

amounts of gold (<4%) in it? As good as 100% tin, better, worse?  If

worse, how much so?

Bev

RIM



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