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January 2008

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Wed, 16 Jan 2008 09:02:45 -0500
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Bev,

I think I would re-state your first sentence.  "We all know that

tin-copper intermetallic that has come to the surface and been exposed

to the environment has terrible solderability."  I view tin-copper as

the glue layer between solder and copper when solder touches copper and

forms an intermetallic the solder above the intermetallic must wet it

otherwise it would fall off. 





Regards, 

George 

George M. Wenger 

Senior Principle FMA / Reliability Engineer 

CommScope / Andrew Wireless Solutions 

40 Technology Drive, Warren, NJ 07059 (908) 546-4531

[log in to unmask] 





-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian

Sent: Wednesday, January 16, 2008 8:52 AM

To: [log in to unmask]

Subject: [TN] Solderability of Tin-Gold Intermetallic



Technetters,

We all know that the tin-copper intermetallic has terrible

solderability.  I also know there are high melting tin-gold solders.  My

question is: what is the solderability of surfaces of tin with small

amounts of gold (<4%) in it? As good as 100% tin, better, worse?  If

worse, how much so?

Bev

RIM



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