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Subject:	Re: copper adhesion to ceramic substrate
From:	"Creswick, Steven" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Creswick, Steven
Date:	Tue, 15 Jan 2008 05:53:23 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (39 lines)

Jesse,

If you do a search for "Direct Bond Copper" or "DBC" you should uncover
many good sources.  

You should not even begin to be concerned about the copper foil peeling
off the alumina substrate!  The bond between the copper oxide and
aluminum oxide is very strong.  Most suppliers will provide information
on method of formation and mechanical data

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Fite,Jesse
Sent: Monday, January 14, 2008 2:26 PM
To: [log in to unmask]
Subject: [TN] copper adhesion to ceramic substrate


I'm looking for advice on how to ensure I will get good adhesion to the
ceramic and/or a company who can join the copper to the ceramic.  Any
help would be appreciated. 
 
Jesse M. Fite


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