You might want to see if you can determine if the component height when
mixed with the force of wave solder pot entry and solder force is really
causing the problem. It would seem with taller or higher component bodies
there would be an increase in drag while having a lower push over rate
versus smaller parts. 

Kat

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tan Geok Ang
Sent: Monday, January 14, 2008 6:46 PM
To: [log in to unmask]
Subject: Re: [TN] Bottom side SMT adhesives

Hi Larry,
		You might want to re-study the pads design of the
components and the solder volumes that is applied onto the pads. Talk to
you solder paste supplier on the holding tension force of the solder
paste.

Regards
GA Tan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Davis, Larry
Sent: Saturday, 12 January 2008 1:38 AM
To: [log in to unmask]
Subject: [TN] Bottom side SMT adhesives

Happy Friday Everyone!

We are currently stencil printing Loctite 3612 for our bottom side SMT
parts.  We have trouble getting larger parts (SOL's, tantalums, etc) to
stay attached consistently.  I'm just wondering what products others are
using for this process and if anyone has had the same issue.

Thanks and have a great weekend!

Larry


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