TECHNET Archives

January 2008

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Franklin Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Franklin Asbell <[log in to unmask]>
Date:
Mon, 14 Jan 2008 15:27:48 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (59 lines)
Try Hytel Group. Their Q-Clad should meet any need your have. As for how you
get good adhesion to ceramic...well you buy it already adhered and then
plate up from the clad copper if necessary. Pretty darn simple.

Franklin



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Fite,Jesse
Sent: Monday, January 14, 2008 1:26 PM
To: [log in to unmask]
Subject: [TN] copper adhesion to ceramic substrate

I'm trying to get artwork laid out on a ceramic substrate.  Our
instrumentations division can add metal and etch the artwork, but I need to
get a ceramic board that already has copper with a good adhesion to the
ceramic board. (I'm worried about it peeling away when the masking is
removed or the card-edge connector is used)
 
I'm looking for advice on how to ensure I will get good adhesion to the
ceramic and/or a company who can join the copper to the ceramic.  Any help
would be appreciated. 
 
Jesse M. Fite
Mechanical Engineer
Brookhaven National Laboratory
Bldg. 911B
Upton, NY 11973
 
Tele: 631-344-2055
Fax: 631-344-5954
email: [log in to unmask]
 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2