Mike

Sometime ago I presented a paper at IPC (and later it was published in PC 
Fab) concerning among other things, copper adhesion. You might want to look 
this over. It includes an analytical analysis of the stresses (tensile and 
shear) produced at the interface of two materials and discusses how to 
design a coupon that will produce the same stresses. Several simularity 
parameters are defined in the study that must carry over from the actual 
design to the coupon. It also points out the futility off peel strength to 
resolve these issues.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message ----- 
From: "Fite,Jesse" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, January 14, 2008 2:25 PM
Subject: [TN] copper adhesion to ceramic substrate


I'm trying to get artwork laid out on a ceramic substrate.  Our 
instrumentations division can add metal and etch the artwork, but I need to 
get a ceramic board that already has copper with a good adhesion to the 
ceramic board. (I'm worried about it peeling away when the masking is 
removed or the card-edge connector is used)

I'm looking for advice on how to ensure I will get good adhesion to the 
ceramic and/or a company who can join the copper to the ceramic.  Any help 
would be appreciated.

Jesse M. Fite
Mechanical Engineer
Brookhaven National Laboratory
Bldg. 911B
Upton, NY 11973

Tele: 631-344-2055
Fax: 631-344-5954
email: [log in to unmask]


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to 
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to 
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
for additional information, or contact Keach Sasamori at [log in to unmask] or 
847-615-7100 ext.2815
----------------------------------------------------- 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------