IPC International Conference on Flexible Circuits

Phoenix, Ariz.

February 13, 2008 - Conference

February 12 & 14, 2008 - Educational Courses

Fine-lined?  Multi-layered?  Highly dense with IC packages on top?  Flex
offers an array of choices with a growing number of benefits.  Learn
about manufacturing technologies, high density flex and new applications
at the IPC International Conference on Flexible Circuits being held
February 12-14, 2008, in Phoenix, Ariz.  Educational courses will be
offered on February 12 and 14. The technical conference will be held
February 13, 2008.  

For more information or to register, please cut and paste
www.ipc.org/flex into your browser and download the registration form.
For additional questions, please contact Alexandra Curtis at +1
847-597-2877 or at [log in to unmask]


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