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Subject:	Re: Bottom side SMT adhesives
From:	"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:	Fri, 11 Jan 2008 15:08:23 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (48 lines)

Talk about a sticky situation. He asks our help and hasn't even done a
GAP analysis yet.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kelly Morris
Sent: Friday, January 11, 2008 2:26 PM
To: [log in to unmask]
Subject: Re: [TN] Bottom side SMT adhesives

Larry:
If you havn't already, you should look at the standoff height, or space 
undernieth of the problem component packages.  SOL's and other SMT 
packages have more standoff and will require a higher adhesive
deposition to 
get a good bond between component and PCB.   If that is the issue, you
may 
have to go to a thicker stencil to get the higher adhesive deposition.

Kelly

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