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January 2008

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Subject:
From:
Bill Kunkle <[log in to unmask]>
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Date:
Fri, 11 Jan 2008 17:04:11 -0500
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Larry,

Also there are high and low yield point adhesives.
High YP can produce dots higher than the foil, for higher standoff
components.
Low YP may slump and produce lower dots.

Bill
MET Assocs

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kelly Morris
Sent: Friday, January 11, 2008 4:26 PM
To: [log in to unmask]
Subject: Re: [TN] Bottom side SMT adhesives


Larry:
If you havn't already, you should look at the standoff height, or space
undernieth of the problem component packages.  SOL's and other SMT
packages have more standoff and will require a higher adhesive deposition to
get a good bond between component and PCB.   If that is the issue, you may
have to go to a thicker stencil to get the higher adhesive deposition.

Kelly

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