Join IPC at one of their upcoming events in California!
Only a few days left to register for IPC's upcoming workshops on January
16, 2008. These workshops are being offered in the beautiful city of San
Jose, CA and are being hosted by Tessera, Inc.!
Fundamentals of Printed Circuit Technology - Materials and Manufacturing
Processes
January 16, 2008 - San Jose, CA
Hosted by Tessera, Inc.
8:30 am - 11:30 am
Instructor: Joseph Fjelstad, Silicon Pipe, Inc.
This half-day course provides a comprehensive overview of this
indispensable technology. It reviews the materials and processes that
comprise the wide array of electronic interconnection substrates used
today and why they were chosen. You will learn about multilayer, metal
core, embossed, flexible and rigid flex circuits and more. Discussions
will also include newer HDI/microvia and embedded passives technologies,
new PCB design concepts and a brief look at the impact of lead free on
PCB manufacturing.
Design Principles for BGA and CSP Technology Implementation
January 16, 2008 - San Jose, CA
Hosted by Tessera, Inc.
1:00 pm - 4:00 pm
Instructor: Vern Solberg, Tessera Technologies, Inc.
This workshop is based on the latest version of the IPC-7095 document,
Design and Assembly Process Implementation for BGAs, and covers both
wide and fine-pitch BGA packaging methodology. The information will
focus on IC packaging standards, review qualification requirements and
study land pattern geometry alternatives, circuit routing guidelines as
well as important factors related to high density PCB fabrication
technologies, assembly process development, inspection criteria and
solder quality assessment.
For more information or to register, please cut and paste
www.ipc.org/Tess0108 into your browser and download the registration
form. Don't' miss this chance - register today!
Design for Manufacture, Assembly and Test
Hosted by Hunter Technology- Santa Clara, Calif.
February 26-27, 2008
Designing printed board assemblies is more difficult today than ever
before. Printed board designers are faced with the continuing design
issues of surface mount vs. through-hole technology, what materials to
use, board size and layer count, how to incorporate electrical testing,
impedance control requirements, and what new specifications are being
invoked on the design process and many other topics. Attendees will have
a unique opportunity to obtain firsthand information on design issues
that affect PCB assembly.
For more information or to register, please visit www.ipc.org/DFAHunter
or contact Michelle Michelotti at +1 847-597-2822 or e-mail
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