TechNeters,
 
 
We used IST data for PCB supplier process health monitoring, for conventional stardard Tin/lead assembly, we follow PWB recomeend cycling temperature from room temperature to 150 degree C. Now, our product transition to lead free assembly,the assembly reflow temperature go up to 245--260 degree C. We are considering to increase the IST cycling temperature to 230 degree C. The pass/fail criteria as 20 to 50 cycles. 
 
I would like to know anyone has the experiece of higher cycling temperature for IST, and any comment on the peak temperature and criteria. Thanks.
 
 
Best Regards,
 
 
Gause Hu
 
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