Hi Bogert
We use RMA, and we find great benefit in doing a cleanliness test. The
operators are instructed to let us know if they find values above a
setpoint we determined internally, which is well below the IPC limit -
if / when we have cleanliness readings higher than normal it lets us
know to go look at the process. We've found things like operators not
doing things quite right, machines not working quite right, and dirty
incoming materials. In these cases the assemblies had passed the test
(per the IPC limit) but even so we found valuable data from the
results... and hopefully avoided bigger problems later.
So I'd have to say it's not just doing a test, it's doing something with
the results. But look at it the other way - how often do you actually
USE your seatbelt and airbag???
regards,
- Graham C
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of - bogert
Sent: Sunday, January 06, 2008 3:05 PM
To: [log in to unmask]
Subject: Re: [TN] specifying board cleanliness
January 6, 2008
If the solder flux used is RMA or equivalent, is there any real benefit
to doing a cleanliness test? I have reviewed OEM cleanliness test
resords at several OEMs and the data I reviewed shows folks rarely, if
ever fail this test.
>From: Graham Collins <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
>[log in to unmask]
>To: [log in to unmask]
>Subject: Re: [TN] specifying board cleanliness
>Date: Thu, 3 Jan 2008 11:09:58 -0400
>
>Happy New Year Phil!
>Well, "it depends"...
>
>First question is how clean do you need them to be? Depends on the
>application and environment. Second question is what sort of assembly
>process the CM is using - if "no clean" then they will be justifiably
>opposed to cleanliness testing.
>
>The generic callout that we most commonly see on drawings is "clean per
>J-STD-001 C-22" - which translates into clean the assembly, both sides,
>and then do an ionic contamination test with a upper limit of 1.56
>micrograms / cm2 NaCl equivalent contamination. I'm not sure why
>J-STD-001 gives an option to only clean one side - never seen that
>process in use. Anyway, a starting point...
>
>regards,
>
>Graham Collins
>Halifax Production Engineering
>L-3 communications Electronic Systems
>(902) 873-2000 ext. 6215
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting
>Sent: Thursday, January 03, 2008 10:45 AM
>To: [log in to unmask]
>Subject: [TN] specifying board cleanliness
>
>Good Morning and Happy New Year to All,
>
>Let me start by confessing my ignorance relative to cleanliness of
>circuit boards. We have no idea what numbers to specify that fit into
>the IPC testing methods for board cleanliness. If I tell my CMs to
>make the boards clean, it would be good to specify a target value and
>or test method.
>
>Can someone give me some guidance on how to chose these specifications?
>What are worth while tests and which ones are window dressing?
>
>I've read through some of the IPC tests methods and my head hurts.
>
>Thanks in advance,
>
>Phil Nutting
>
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