Well, then, we have a heffalump of a whole different color. See, when
someone says "boards" to me, there are no components. When someone says
"assemblies" they have components.
So, then, is your basic question "What kinds of language do I put in my
procurement documents, using IPC test methods, that give me clean
assemblies coming from my contract manufacturer"?
Doug Pauls
Phil Nutting <[log in to unmask]>
01/03/2008 11:31 AM
To
"[log in to unmask]" <[log in to unmask]>
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Subject
RE: [TN] specifying board cleanliness
Doug,
I forgot in my original e-mail that I'm concerned with populated boards.
So I'm guessing there is a different document for that. The tests are
listed in IPC-TM-650, but my eye glass over when I try to decipher these.
I know designing by thumb nail is a bad practice, but what is there for us
who are practically laymen?
Thanks,
Phil
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, January 03, 2008 10:02 AM
To: Phil Nutting
Subject: Re: [TN] specifying board cleanliness
And, here is the 5701 I referenced.
Doug Pauls
Phil Nutting <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
01/03/2008 08:44 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Phil Nutting <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TN] specifying board cleanliness
Good Morning and Happy New Year to All,
Let me start by confessing my ignorance relative to cleanliness of circuit
boards. We have no idea what numbers to specify that fit into the IPC
testing methods for board cleanliness. If I tell my CMs to make the
boards clean, it would be good to specify a target value and or test
method.
Can someone give me some guidance on how to chose these specifications?
What are worth while tests and which ones are window dressing?
I've read through some of the IPC tests methods and my head hurts.
Thanks in advance,
Phil Nutting
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