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Date: | Mon, 14 Jan 2008 16:24:35 -0500 |
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Mike
Sometime ago I presented a paper at IPC (and later it was published in PC
Fab) concerning among other things, copper adhesion. You might want to look
this over. It includes an analytical analysis of the stresses (tensile and
shear) produced at the interface of two materials and discusses how to
design a coupon that will produce the same stresses. Several simularity
parameters are defined in the study that must carry over from the actual
design to the coupon. It also points out the futility off peel strength to
resolve these issues.
Best regards
Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: "Fite,Jesse" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, January 14, 2008 2:25 PM
Subject: [TN] copper adhesion to ceramic substrate
I'm trying to get artwork laid out on a ceramic substrate. Our
instrumentations division can add metal and etch the artwork, but I need to
get a ceramic board that already has copper with a good adhesion to the
ceramic board. (I'm worried about it peeling away when the masking is
removed or the card-edge connector is used)
I'm looking for advice on how to ensure I will get good adhesion to the
ceramic and/or a company who can join the copper to the ceramic. Any help
would be appreciated.
Jesse M. Fite
Mechanical Engineer
Brookhaven National Laboratory
Bldg. 911B
Upton, NY 11973
Tele: 631-344-2055
Fax: 631-344-5954
email: [log in to unmask]
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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