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January 2008

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Subject:
Re: Lead-free HASL finishes
From:
Phil Nutting <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 10 Jan 2008 16:05:55 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (56 lines) 
Richard,

HASL is Hot Air Solder Leveling, using actual molten solder.

Immersion tin and matte tin are chemical bath processes.

These are two completely different processes.

Are you trying to meet a customer request?

Phil

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Thursday, January 10, 2008 3:54 PM
To: [log in to unmask]
Subject: [LF] Lead-free HASL finishes

I know that some of you had discussion about this topics on the forums,
but I just wanted to verify that when we are talking about Pb-free HASL
we are talking about Immersion Tin finish. Correct? Or are there other
Pb-free HASLs that are different? Are there different products such as
matte finish Pb-free HASL versus some other type of Sn finish?

And is there an IPC standard for Pb-free HASL?

I am not talking about RoHS -compatible finishes, such as ENIG, ENEPIG,
IAg, OSP, etc.,  just lead-free HASL finishes.

Is there a Pb-free fused tin finish?

What standards are being developed or have been developed for Immersion
Tin finishes? I could not find any at IPC.org, but I may have missed
them. I know of IPC 4552 for ENIG, 4553 for Immersion Silver, etc. but
could not find a similar standard for Immersion Tin finish.

Thanks for any help you can provide.

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