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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Wed, 30 Jan 2008 15:27:01 -0600 |
Content-Type: | text/plain |
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Werner,
What I've been finding has more to do with testing an assembly's ability to
withstand mechanical stress, and making projections from there. We know
we're far exceeding that. That's our first step - retraining. What I think I'm
going to need to provide is some data about how confident we can be in
keeping products alive if we can't be sure the joints aren't partially cracked.
I'm really fighting an uphill battle here. We're not willing to spend the money,
we have an inadequate facility, and they want me to tell them how OK it
might be, since they REALLY don't want to stop production of our flagship
product.
As for "common" problems, I'm suppose I'm referring more to a common
symptom of the problem - the reason many BGAs have GND pins in the
corners. That's where the stress shows up first.
And I wish I had a Dew for every time I've suggested a consultant - this is SO
not my area of expertise! (and yes, your name is likely to come up again....)
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